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IBM, Government of Canada, Government of Quebec Sign Agreements to Strengthen Canada's Semiconductor Industry

Newswire.ca - Fri Apr 26, 9:20AM CDT

Up to $187M CAD to be invested to progress expansion of chip packaging capacity and capabilities and to strengthen R&D at IBM Canada's Bromont plant

BROMONT, QC, April 26, 2024 /CNW/ -- IBM (NYSE: IBM), the Government of Canada, and the Government of Quebec today announced agreements that will strengthen Canada's semiconductor industry, and further develop the assembly, testing and packaging (ATP) capabilities for semiconductor modules to be used across a wide range of applications including telecommunications, high performance computing, automotive, aerospace & defence, computer networks, and generative AI, at IBM Canada's plant in Bromont, Quebec. The agreements reflect a combined investment valued at approximately $187M CAD.

Read more at newswire.ca

Provided Content: Content provided by Newswire.ca. The Globe and Mail was not involved, and material was not reviewed prior to publication.

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